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AMD EPYC 7313P processor 3 GHz 128 MB L3
Processor socket | Socket SP3 |
---|---|
Processor cores | 16 |
Processor family | AMD EPYC |
EAN | 8592978317959 |
Manufacturer | AMD |
Availability | Y |
Product Family | EPYC |
AMD EPYC 7313P – Optimized Power for Modern Servers
Deliver high-efficiency processing with the AMD EPYC 7313P, designed to strike the perfect balance between performance, scalability, and reliability in enterprise-grade server deployments.
Octa-Channel Memory for Maximum Bandwidth
With eight DDR4 memory channels supporting up to 3200 MHz, the EPYC 7313P provides massive bandwidth to meet the demands of virtualization, high-performance computing, and intensive data processing.
Socket SP3 Compatibility for Infrastructure Stability
Engineered for full compatibility with AMD's robust SP3 ecosystem, this processor easily integrates with proven server platforms—delivering consistency, efficiency, and thermal reliability.
Built for the Server Market Segment
Optimized specifically for modern data center workloads, the EPYC 7313P is your go-to choice for cloud-native applications, virtualization, and enterprise IT environments.
Trusted AMD Architecture for Mission-Critical Uptime
Backed by AMD’s legacy of server innovation, the EPYC 7313P delivers secure, stable, and predictable compute performance—so your infrastructure keeps running, even when the workloads surge.
Processor | |
---|---|
Processor base frequency | 3 GHz |
Processor manufacturer | AMD |
Configurable TDP-down | 155 W |
Thermal Design Power (TDP) | 155 W |
Processor cache | 128 MB |
Processor model | 7313P |
Processor threads | 32 |
Processor boost frequency | 3.7 GHz |
Component for | Server/workstation |
Processor family | AMD EPYC |
Processor cores | 16 |
Processor socket | Socket SP3 |
Configurable TDP-up | 180 W |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Power | |
Configurable TDP-down | 155 W |
Thermal Design Power (TDP) | 155 W |
Technical details | |
---|---|
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 155 W |
Market segment | Server |
Configurable TDP-up | 180 W |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 155 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Processor special features | |
Configurable TDP-up | 180 W |
Logistics data | |
Harmonized System (HS) code | 85423119 |
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---|---|---|---|---|---|---|
SKU |
100-000000339
|
CD8067303561400
|
P23549-B21
|
100-000000345
|
CD8068904665802
|
P36922-B21
|
Manufacturer |
AMD
|
Intel
|
HPE
|
AMD
|
Intel
|
HPE
|
Processor lithography |
N/A
|
up to 22nm
|
up to 22nm
|
N/A
|
up to 22nm
|
up to 22nm
|
Processor cores |
16
|
8
|
10
|
32
|
8
|
16
|
Cooler included |
N/A
|
N
|
N
|
N/A
|
N
|
N
|
Processor family |
AMD EPYC
|
Intel Xeon Silver
|
Intel Xeon Silver
|
AMD EPYC
|
Intel Xeon Gold
|
Intel Xeon Silver
|
Processor socket |
Socket SP3
|
LGA 3647 (Socket P)
|
LGA 3647 (Socket P)
|
Socket SP3
|
LGA 4189
|
LGA 4189
|
On-board graphics card |
N/A
|
N
|
N
|
N/A
|
N
|
N
|
Discrete graphics card |
N/A
|
N/A
|
N
|
N/A
|
N
|
N
|
Package type |
N/A
|
Retail box
|
Tray
|
N/A
|
Tray
|
Tray
|